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ECC100 series ? -40 oc to +75 oc operation ? 100 w - baseplate cooled ? high efficiency resonant topology ? screw terminals available ? 5v standby output ? remote on/off & power ok signal ? 3 year warranty the ECC100 is a conduction cooled single output ac-dc power supply. it is designed for use in harsh environments where wide temperature variation and sealed enclosure installation is common place. featuring highly efficient resonant mode topology, whi lst maintaining its cost effectiveness, the ECC100 also provides remote sense, remote on/off, a combined ac & dc fail signal which coupled with its own standby rail ensures that control and status reporting is easily achievable. comprehensive overload, short circuit, over voltage and over temperature are built into the ECC100 as standard. an optional sur ge filter provides further protection from incoming ac surges to level 4 of en61000-4-5.
xppower.com 2 input characteristics characteristic minimum typical maximum units notes & conditions input voltage - operating 85 115/230 264 vac derate output power < 90 vac. see fig. 1. power ok signal cannot be used <90 vac. input frequency 47 50/60 400 hz agency approval 47-63 hz power factor > 0.5 230 vac, 100% load en61000-3-2 class a compliant input current - no load 0.07/0.09 a 115/230 vac input current - full load 1.5/0.9 a 115/230 vac inrush current 40 a 230 vac cold start, 25 oc earth leakage current 110/190 300 a 115/230 vac/50 hz (typ.), 264 vac/60 hz (max.) 0.5/1.2 ma 115/230 vac/400 hz input protection t5.0a/250 v internal fuse in both line and neutral output characteristics characteristic minimum typical maximum units notes & conditions output voltage - v1 12 48 vdc see models and ratings table initial set accuracy 1 (v1) & 3 (v2) % 50% load, 115/230 vac output voltage adjustment 5 % v1 only via potentiometer. see mech. details (p13). minimum load 0 a start up delay 1.0 s 230 vac full load (see fig.2)* hold up time 16 20 ms 115 vac full load (see fig.3 & 4) drift 0.2 % after 20 min warm up line regulation 0.5 % 90-264 vac load regulation 1 (v1) , 5 (v2) % 0-100% load transient response - v1 4 % recovery within 1% in less than 500 s for a 50-75% and 75-50% load step over/undershoot - v1 5 % see fig.5 ripple & noise 1 (v1) & 2 (v2) % pk-pk 20 mhz bandwidth (see fig.6 & 7) overvoltage protection 115 140 % vnom dc. output 1 only, recycle input to reset overload protection 110 150 % i nom output 1 only, auto reset (see fig.8) short circuit protection continuous, trip & restart (hiccup mode) all outputs temperature coefficient 0.05 %/?c overtemperature protection 110 c main transformer sensor shutdown models and ratings notes: 1. for optional surge filter add suffix ?-f? to model number, e.g. ECC100us12-f. 2. add suffix -s for screw terminals, consult sales for restrictions and availability . output power output voltage v1 max output current v1 standby supply v2 model number 100 w 12.0 vdc 8.1 a 5.0 v/0.5 a ECC100us12 100 w 15.0 vdc 6.5 a 5.0 v/0.5 a ECC100us15 100 w 24.0 vdc 4.1 a 5.0 v/0.5 a ECC100us24 100 w 28.0 vdc 3.5 a 5.0 v/0.5 a ECC100us28 100 w 48.0 vdc 2.0 a 5.0 v/0.5 a ECC100us48 * at low temperature and low line voltage, start up time will increase.
xppower.com 3 start up delay from ac turn on figure 2 v1 & v2 start up example from ac turn on hold up time from loss of ac figure 3 v1 hold up example at 100 w load with 90 vac input (16.7 ms) figure 4 v1 & v2 hold up example at 100 w load 90 vac input ac v1 v2 input voltage derating 90 80 60 10 70 100 85 90 264 input voltage (vac) output power (w) figure. 1 ac v1 v2
output ripple & noise figure 6 v1 ECC100 (full load) 27 mv pk-pk ripple. 20 mhz bw xppower.com 4 output overshoot figure 5 typical output overshoot (ECC100us12 shown)
output ripple & noise cont. figure 7 v1 ECC100us12 (full load) 39 mv pk-pk ripple. 20 mhz bw xppower.com 5 output overload characteristic figure 8 typical v1 overload characteristic (ECC100us12 shown) output enters trip & restart mode 0 2 4 6 8 10 12 14 012345678 output current (a) output volts (v)
xppower.com xxxxxxxxxx 6 general specifications characteristic minimum typical maximum units notes & conditions efficiency 88 % full load (see fig.9 & 10 ) isolation: input to output input to ground output to ground 4000 vac 1500 vac 500 vac switching frequency 70 khz power density 3.9 w/in 3 mean time between failure 236 khrs mil-hdbk-217f, notice 2 +25 c gb weight 0.7 (320) lb (g) characteristic notes & conditions signals &? control remote sense compensates for 0.5 v total voltage drop power ok (combined ac ok & dc ok) open collector referenced to logic ground & output 0v, transistor normally off when ac is good (see fig.11 - 15) ac ok: provides 3 ms warning of loss of output from ac failure remote on/off (inhibit/enable) uncommited isolated optocoupler diode, powered diode inhibits the supply (see fig.16-21) standby supply v3 5 v/0.5 a supply, always present when ac supplied, referenced to logic ground and output 0v efficiency versus load ta = 25oc efficiency 60% 65% 70% 75% 80% 85% 90% 0% 20% 40% 60% 80% 100% 120% amount of load efficiency (%) vin = 115vac vin = 230vac efficiency at ta = +25oc 65% 60% 70% 75% 80% 85% 90% 0% 20% 40% 60% 80% 100% 120% load efficiency (%) vin = 115vac vin = 230vac figure 9 ECC100us12 at 115 & 230 vac figure 10 ECC100us24 at 115 & 230 vac
xppower.com 7 signals power ok power ok - timing diagram power ok collector pin 4 logic gnd pin 2 & 3 power supply transistor on (<0.8 v): fault transistor off (>4.5 v): ok j3 signal connector 330r 5 v standby pin 1 max 12 v 20 ma figure 11 ac power ok signal v1 output transistor off 90% 90% 100-500 ms 3 ms undefined period undefined period figure 12
xppower.com 8 figure 15 v1 warning time example at power ok signal 90 vac 100 w load (11.2 ms) signals (contd) power ok figure 13 power ok signal example at ac switch on power ok v1 v2 figure 14 power ok signal example at ac switch off power ok v1 v2
xxxxxxxxxx xppower.com 9 signals (contd) remote on/off (inhibit/enable) figure 19 example of outputs switching on when inhibit (lo) configuration used & switch open figure 18 example of outputs switching off when inhibit (lo) configuration used & switch closed inhibit hi j3 pin 5 power supply 1k signal connector inhibit lo j3 pin 6 5 v standby j3 pin 1 logic gnd pin j3 pins 2 & 3 8 v max 5 ma max figure 16 inhibit (hi) 8 v max inhibit hi j3 pin 5 power supply 1k signal connector inhibit lo j3 pin 6 5 v standby j3 pin 1 logic gnd j3 pins 2 & 3 5 ma figure 17 inhibit (lo) inhibit v1 v2 inhibit v1 v2
xppower.com xxxxxxxxxx 10 signals (contd) inhibit hi j3 pin 5 power supply 1k signal connector inhibit lo j3 pin 6 5 v standby j3 pin 1 logic gnd j3 pins 2 & 3 1k 5 ma inhibit hi j3 pin 5 power supply 1k j3 pins 2 & 3 inhibit lo j3 pin 6 5 v standby j3 pin 1 logic gnd 1k 5 ma signal connector figure 20 enable (hi) figure 21 enable (lo) remote on/off (inhibit/enable)
xppower.com xxxxxxxxxx 11 environmental characteristic minimum typical maximum units notes & conditions operating temperature -40 +75 oc baseplate must not exceed 85oc. see thermal considerations. warm up time 20 minutes storage temperature -40 +85 oc cooling baseplate cooled humidity 5 95 %rh non-condensing operating altitude 3000 m shock 3 x 30 g/11 ms shocks in both +ve & -ve directions along the 3 orthogonal axis, total 18 shocks. vibration triple axis 5-500 hz at 2 g x 10 sweeps electromagnetic compatibility - immunity phenomenon standard test level criteria notes & conditions low voltage psu emc en61204-3 high severity level as below harmonic current en61000-3-2 class a radiated en61000-4-3 3 a eft en61000-4-4 3 a surges en61000-4-5 installation class 3 a installation class 4 a with option -f conducted en61000-4-6 3 a dips and interruptions en61000-4-11 dip: 30% 10 ms a dip: 60% 100 ms b dip: 100% 5000 ms b electromagnetic compatibility - emissions phenomenon standard test level criteria notes & conditions conducted en55022 class b radiated en55022 class a voltage fluctuations en61000-3-3 safety agency approvals safety agency safety standard category cb report ul file #e139109-a42-cb-1, iec60950-1 (2005) second edition information technology ul ul file #e139109-a42-ul, ul60950-1, 2nd edition, 2007-03-27, csa c22.2 no 60950-1-07 2nd edition 2007-03 information technology tuv tuv certificate b 09 12 57396 067, en60950-1/a11:2009 information technology ce lvd equipment protection class safety standard notes & conditions class i iec60950-1:2005 ed 2 see safety agency conditions of acceptibility for details
xppower.com xxxxxxxxxx 12 mechanical details - ECC100usxx notes 0.25 faston ground tab 4 x m3-0.5 2 x 0.20 (5.1) 2.30 (58.4) 2 x 4.60 (116.8) 5.00 (127.0) 1.55 (39.4) 2 x 0.23 (5.8) j1 1 2 3 x 0.20 (5.1) 0.40 (10.2) 2 x 3.70 (94.0) 5 x m3 clearance holes 4.10 (104.1) 3.30 (83.8) voltage adj. mounting surface marked with ?a? screw terminal side view j2 j3 1 1 2 10 9 8 a a aaa 2 1 0 1 9 2 1 j 1 8 1 0.40 (10.2) 4.10 (104.1) 3.30 (83.8) input connector j1 molex pn 09-65-2038 1 line 2 neutral 1. all dimensions in inches (mm). 2. tolerance .xx = 0.02 (0.50); .xxx = 0.01 (0.25) 3. weight 1.2 lbs (550g) j1 mates with molex housing pn 09-50-1031 . output connector j2 molex pn 09-65-2088 pin single output 1 +v1 2 +v1 3 +v1 4 +v1 5 rtn 6 rtn 7 rtn 8 rtn j2 mates with molex housing pn 09-50-1081 and both with molex series 5194 crimp terminals . signal connector j3 molex pn b10b-phdss 1 +5 v standby 2 logic gnd 3 logic gnd 4 power ok 5 inhibit hi 6 inhibit lo 7 +sense 8 -sense 9 +vout 10 -vout j3 mates with jst housing pn phdr-10vs and with jst sphd-001t-p0.5 crimp terminals.
xppower.com xxxxxxxxxx 13 mechanical details - ECC100usxx-f notes input connector j1 molex pn 09-65-2038 1 line 2 neutral 1. all dimensions in inches (mm). 2. tolerance .xx = 0.02 (0.50); .xxx = 0.01 (0.25) 3. weight 1.2 lbs (550g) j1 mates with molex housing pn 09-50-1031 . output connector j2 molex pn 09-65-2088 pin single output 1 +v1 2 +v1 3 +v1 4 +v1 5 rtn 6 rtn 7 rtn 8 rtn j2 mates with molex housing pn 09-50-1081 and both with molex series 5194 crimp terminals . signal connector j3 molex pn b10b-phdss 1 +5 v standby 2 logic gnd 3 logic gnd 4 power ok 5 inhibit hi 6 inhibit lo 7 +sense 8 -sense 9 +vout 10 -vout j3 mates with jst housing pn phdr-10vs and with jst sphd-001t-p0.5 crimp terminals. 0.25 faston ground tab j2 j3 1.55 (39.4) 2.50 (63.50) 2 x 0.20 (5.08) output interface connector voltage adjust logic connector 5 x m3 clearance holes 2.30 (58.42) 2 x 4.60 (116.84) a a a a a 2 10 1 0 1 9 2 1 j1 j 1 8 1 5.00 (127.0) 5.00 (127.0) 0.20 (5.08) 3.70 (93.98) 0.40 (10.2) 1.55 (39.3) 2.50 (63.5) 4.10 (104.1) 3.30 (83.8)
xppower.com xxxxxxxxxx 14 thermal considerations - baseplate cooling the use of power supplies in harsh or remote environments brings with it many fundamental design issues that must be fully unde rstood if long-term reliability is to be attained. under these conditions, it is generally accepted that electronic systems have to be sealed against the elements. this makes the removal of unwanted heat particularly difficult. the use of forced-air cooling is undesirable as it increases system size, adds the maintenance iss ues of cleaning or replacing filters, and the fan being prone to wear out, particularly in tough environments. the extremes of ambient temperature encountered in remote sites can range from -40 oc to over+40 c. it is common for the tempe rature within the enclosure to rise some 15 to 20 c above the external temperature. the positioning of the power supply within the enclosure can help minimize the ambient temperature in which it operates and this can have a dramatic effect on system reliability. system enclosures are typically sealed to ip65, ip66 or nema 4 standards to prevent ingress of dust or water. removal of heat f rom other electronic equipment and power supplies in a situation with negligible airflow is the challenge. from the power system perspective, the mo st effective solution is to remove the heat using a heatsink that is external to the enclosure. however, most standard power supplies cannot provide an adequate thermal path between the heat-dissipating components within the unit and the external environment. fundamentally, the successful design of a power supply for use within sealed enclosures relies on creating a path with low ther mal resistance through which conducted heat can be passed from heat- generating components to the outside world. the components that generate the most heat in a power supply are distributed throughout the design, from input to output. they include the power fet used in an active pfc circuit, the pfc inductor, power transformers, rectifiers, and power switches. heat can be removed fr om these components by thermally connecting them to the base-plate that in turn can be affixed to a heatsink. as mentioned earlier, the heatsink is then located outside of the enclosure. dissipating the heat: heatsink calculations three basic mechanisms contribute to heat dissipation: conduction, radiation and convection. all mechanisms are active to some degree but once heat is transferred from the baseplate to the heatsink by conduction, free convection is the dominant one. effective conduction between the baseplate and heatsink demands flat surfaces in order to achieve low thermal resistance. heat transfer can be maximized by the use of a thermal compound that fills any irregularities on the surfaces. system designers should aim to keep t hermal resistance between baseplate and heatsink to below 0.1 c/w. this is the performance offered by most commonly used thermal compounds when applied in accordance with manufacturers instructions. radiation accounts for less than 10% of heat dissipation and precise calculations are complex. in any case, it is good practice to consider this 10% to be a safety margin. pcb power transistor baseplate of power supply ambient external heatsink inductor basic construction of baseplate cooled psu with all of the major heat-generating components thermally connected to the baseplate
the following example shows how to calculate the heatsink required for an ECC100us12 with 230 vac input and an output load of 9 0 w operating in a 40 oc outside ambient temperature. 1. calculate the power dissipated as waste heat from the power supply. the efficiency (see fig. 9 & 10) and worst case load fig ures are used to determine this using the formula: waste heat = = 2. estimate the impedance of the thermal interface between the power supply baseplate and the heatsink. this is typically 0.1c /w when using a thermal compound. 3. calculate the maximum allowable temperature rise on the baseplate. the allowable temperature rise is simply: t b C t a where t a is the maximum ambient temperature outside of the cabinet and t b is the maximum allowable baseplate temperature. 4. the required heatsink is defined by its thermal impedance using the formula: h = t b C t a -0.1 = 85 oc C 40 oc -0.1 = 3.23 oc/w waste power 13.5 w 5. the final choice is then based on the best physical design of heatsink for the application that can deliver the required the rmal impedance. the systems construction will determine the maximum available area for contact with the baseplate of the power supply and the avai lable space outside of the enclosure will then determine the size, number and arrangement of cooling fins on the heatsink to meet the dissipation requ irement. xppower.com { } x p out eff% 1 - eff% { } x 90 w = 13.5 w 0.87 1 - 0.87 10-sept-12

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